HEAT APPLIED CHITOSAN TREATMENT ON HARDWOOD CHIPS TO IMPROVE PHYSICAL AND MECHANICAL PROPERTIES OF PARTICLEBOARD

Mehmet Altay Basturk

Abstract


High-heat treatment after surface application of chitosan was used in an effort to improve physical and mechanical performances of particleboard. Particleboard is mainly used in the furniture industry and also used as a home decoration material; however, it has a poor dimensional stability. In this work, hardwood chips were obtained from a commercial plant; half of the chips were used for the control panels without chitosan treatment, and the other half were treated with chitosan acetate solutions (2% wt). Those chitosan-treated particles were also exposed to extra high-heat (140°C) treatment for 90 minutes to convert chitosan acetate back to chitin. Liquid phenol-formaldehyde resin was sprayed onto dry particles at a level of 6 and 7% (wt) based upon oven-dry weight. The mat was pressed (200°C) for 11 minutes to form 19 mm thickness and a target of 0.63 g cm-3 density panels. Thickness swelling, linear expansion, and water gain of the treated panels were reduced over untreated panels during a 24-hour water-soak test. In addition, chitosan-treated panels showed better internal bond strength than control panels. Static bending test results showed a negative effect for the chitosan treated particleboard.

Keywords


Particleboard; Chitosan; Dimensional stability; Chitin

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