Anti-Mildew Properties of Copper Cured Heat-Treated Wood

Guijun Xie, Yongdong Zhou, Yongjian Cao, Lamei Li


The dimensional stability and resistance to degradation of wood can be improved using high temperature heat treatment under anaerobic conditions; however, mildew growth can have a deleterious impact on its appearance and commercial value. In this study, wood samples were impregnated in copper-containing solutions at high pressure before being recovered and cured at high temperatures to create treated wood samples with nano copper particles. This copper impregnated wood (up to 6.35% copper content) suppressed the growth of Botryodiplodia theobromae Pat. and Aspergillus niger van Tieghem with 100% efficiency, and Penicillium citrinum Thom with 75% efficiency. However, the growth of Trichoderma viride Pers was not suppressed. These results demonstrate that copper curing can be used to extend the scope, performance, and lifetime of heat-treated wood, enabling it to be used for a new range of applications.


Copper-containing compounds; Heat treatment of wood; Anti-mildew; SEM; XRD; XPS; Nano copper particles

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