Thermal Stability and Bonding Mechanisms of Corn Stalk Rind

Xun He, Kaifei Zhang, Wanzhang Wang, He Li, Qingqiang Yin


Removing the epidermis of corn stalk rind can remarkably improve its bonding properties. This study aimed to determine the plate-making process by using intact corn stalk rind and thus utilize the crushed, removed epidermis. The thermal stability of corn stalk rind was investigated before and after removing the epidermis and gluing of the material using the hyphenated technique by simultaneous thermal analysis (STA), Fourier transform infrared spectroscopy (FT-IR), and gas chromatography-mass spectrometry (GC-MS). The results showed that the epidermis of corn stalk rind, from 90 °C to 200 °C, was conducive to softening the lignin in corn stalk rind and solidifying it as an adhesive. When the temperature was higher than 220 °C, the rate of weight loss rapidly increased and the thermal decomposition of hemicelluloses and cellulose in corn stalk rind after gluing was accelerated. The bonding process of corn stalk rind and adhesives is extremely complex, and intricate physical and chemical changes occur. Adhesive filled the surface cracks and depressions on the corn stalk rind, which not only improved its thermal stability, but also fixed corn stalk rind by forming connections.


Corn stalk rind; Epidermis; Thermal stability; Bonding mechanism

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