Preparation and Properties of Thermally Conductive Copper Paper

Haohui Kong, Senlin Chen, Weijian He, Cuiling Chen, Junzhang Wu, Hongyan Ma, Fei Yang

Abstract


A new thermally conductive copper paper was prepared with cellulose pulp and ultrafine copper powder in a traditional paper making process. The thermal conductivity of the copper paper was studied in different weight ratios, and the surface morphology was observed by scanning electron microscopy (SEM). The results showed that the addition of copper powder enhanced the thermal conductivity of copper paper distinctly, with a maximum of up to 0.560 w•m-1•K-1 in the weight ratio of pulp/copper of 1:12, which was an increase of 143% compared with the paper without copper. Scanning electron microscopy images showed that copper papers consisted of copper powder particles distributing compactly on the fiber surface. The tensile index of copper paper decreased compared with the paper without filler. A calendaring process was used to improve the combination between copper particles and fibers and to enhance the thermal conductivity of copper paper.

Keywords


Copper paper; Thermal conductivity; Ultrafine copper powder

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