Investigation of a Formaldehyde-free Cottonseed Flour-based Adhesive for Interior Plywood

Nairong Chen, Jian Huang, Kaichang Li


A new formaldehyde-free wood adhesive, primarily composed of defatted cottonseed flour (CF) and polyamine-epichlorohydrin (K736) resin, was investigated for the preparation of interior plywood. Sodium hydroxide was an essential component of the adhesive. The effects of pH values of the CF-K736 adhesive, the CF/K736 weight ratio on the pot life of the adhesive, and the water resistance of the resulting plywood panels were investigated in detail. The hot-pressing temperature and time were optimized in terms of the water resistance of the resulting plywood panels. The resulting 5-ply plywood panels met the industrial water resistance requirements for interior application under the following conditions: pH > 11, CF/K736 weight ratio in the range of 8/1 to 5/1, hot-press temperature ≥ 120 °C, and hot-pressing time > 4 min. The pot life of the adhesive was approximately 3 h when the pH was 12 and the CF/K736 weight ratio was 8/1. The curing mechanism of the adhesive is discussed.


Cottonseed flour; Formaldehyde-free; Polyamine epichlorohydrin resin; Water resistance; Wood composites

Full Text:


Welcome to BioResources! This online, peer-reviewed journal is devoted to the science and engineering of biomaterials and chemicals from lignocellulosic sources for new end uses and new capabilities. The editors of BioResources would be very happy to assist you during the process of submitting or reviewing articles. Please note that logging in is required in order to submit or review articles. Martin A. Hubbe, (919) 513-3022,; Lucian A. Lucia, (919) 515-7707, URLs:; ISSN: 1930-2126