Effects of the Type of Lactic Acid Bacteria, Hot-Pressing Temperature, and Moisture Content of Fermented Bamboo Residue on the Properties of Self-bonding Common Particleboards

Abstract

Self-bonding bamboo particleboards were prepared via hot pressing of bamboo residue fermented by lactic acid bacteria. An orthogonal experiment was designed to investigate the effects of three factors (type of lactic acid bacteria used for fermentation, moisture content (MC) of the fermented residue, and hot-pressing temperature) on the resulting self-bonding particleboards. The bending strength and internal bonding strength of the prepared self-bonding particleboards were tested. Fracture characterization was performed on the cross-section of the prepared self-bonding particleboards after bending breakage. The hot-pressing temperature, moisture content (MC), and type of lactic acid bacteria of the fermented residue had a significant effect on the mechanical strength of self-bonding particleboards, and with increased hot-pressing temperature, the strength of self-bonding particleboards increased. Analysis of the cross-sectional morphology and porosity confirmed the significant effect of hot-pressing temperature on the density distribution of self-bonding particleboards. The self-bonding particleboard produced at the hot-pressing temperature of 180 °C, MC of 30%, and that used Lactobacillus plantarum as a fermentation strain showed the best overall performance and reached Chinese standard requirements for common particleboards.